Enhancement of Bandwidth-Responsivity Product in High-Speed Avalanche Photodiodes with Optimized Flip-Chip Bonding Package for Coherent Detection

Naseem, Nan-Wei Chen, Syed Hasan Parvez, Zohauddin Ahmad, Sean Yang, H. S. Chen, Hsiang-Szu Chang, Jack Jia-Sheng Huang, Jin-Wei Shi. Enhancement of Bandwidth-Responsivity Product in High-Speed Avalanche Photodiodes with Optimized Flip-Chip Bonding Package for Coherent Detection. In Optical Fiber Communications Conference and Exhibition, OFC 2023, San Diego, CA, USA, March 5-9, 2023. pages 1-3, IEEE, 2023. [doi]

Authors

Naseem

This author has not been identified. Look up 'Naseem' in Google

Nan-Wei Chen

This author has not been identified. Look up 'Nan-Wei Chen' in Google

Syed Hasan Parvez

This author has not been identified. Look up 'Syed Hasan Parvez' in Google

Zohauddin Ahmad

This author has not been identified. Look up 'Zohauddin Ahmad' in Google

Sean Yang

This author has not been identified. Look up 'Sean Yang' in Google

H. S. Chen

This author has not been identified. Look up 'H. S. Chen' in Google

Hsiang-Szu Chang

This author has not been identified. Look up 'Hsiang-Szu Chang' in Google

Jack Jia-Sheng Huang

This author has not been identified. Look up 'Jack Jia-Sheng Huang' in Google

Jin-Wei Shi

This author has not been identified. Look up 'Jin-Wei Shi' in Google