Enhancement of Bandwidth-Responsivity Product in High-Speed Avalanche Photodiodes with Optimized Flip-Chip Bonding Package for Coherent Detection

Naseem, Nan-Wei Chen, Syed Hasan Parvez, Zohauddin Ahmad, Sean Yang, H. S. Chen, Hsiang-Szu Chang, Jack Jia-Sheng Huang, Jin-Wei Shi. Enhancement of Bandwidth-Responsivity Product in High-Speed Avalanche Photodiodes with Optimized Flip-Chip Bonding Package for Coherent Detection. In Optical Fiber Communications Conference and Exhibition, OFC 2023, San Diego, CA, USA, March 5-9, 2023. pages 1-3, IEEE, 2023. [doi]

Abstract

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