DREAM: A Chip-Package Co-Design Tool for RF-Mixed Signal Systems - researchr publication authors

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Ghanshyam Nayak, Tejasvi Das, T. M. Rao, P. R. Mukund. DREAM: A Chip-Package Co-Design Tool for RF-Mixed Signal Systems. In 2004 IEEE Computer Society Annual Symposium on VLSI (ISVLSI 2004), Emerging Trends in VLSI Systems Design, 19-20 February 2004, Lafayette, LA, USA. pages 207-210, IEEE Computer Society, 2004. [doi]

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