Ghanshyam Nayak, Tejasvi Das, T. M. Rao, P. R. Mukund. DREAM: A Chip-Package Co-Design Tool for RF-Mixed Signal Systems. In 2004 IEEE Computer Society Annual Symposium on VLSI (ISVLSI 2004), Emerging Trends in VLSI Systems Design, 19-20 February 2004, Lafayette, LA, USA. pages 207-210, IEEE Computer Society, 2004. [doi]
@inproceedings{NayakDRM04,
title = {DREAM: A Chip-Package Co-Design Tool for RF-Mixed Signal Systems},
author = {Ghanshyam Nayak and Tejasvi Das and T. M. Rao and P. R. Mukund},
year = {2004},
url = {http://csdl.computer.org/comp/proceedings/isvlsi/2004/2097/00/20970207abs.htm},
tags = {design},
researchr = {https://researchr.org/publication/NayakDRM04},
cites = {0},
citedby = {0},
pages = {207-210},
booktitle = {2004 IEEE Computer Society Annual Symposium on VLSI (ISVLSI 2004), Emerging Trends in VLSI Systems Design, 19-20 February 2004, Lafayette, LA, USA},
publisher = {IEEE Computer Society},
isbn = {0-7695-2097-9},
}