Philip G. Neudeck, David J. Spry, Michael J. Krasowski, Liangyu Chen. The Path Towards Realistic ASIC Electronics Deployment Into Previously Impractical Extreme Application Environments. In Device Research Conference, DRC 2022, Columbus, OH, USA, June 26-29, 2022. pages 1-2, IEEE, 2022. [doi]
@inproceedings{NeudeckSKC22,
title = {The Path Towards Realistic ASIC Electronics Deployment Into Previously Impractical Extreme Application Environments},
author = {Philip G. Neudeck and David J. Spry and Michael J. Krasowski and Liangyu Chen},
year = {2022},
doi = {10.1109/DRC55272.2022.9855806},
url = {https://doi.org/10.1109/DRC55272.2022.9855806},
researchr = {https://researchr.org/publication/NeudeckSKC22},
cites = {0},
citedby = {0},
pages = {1-2},
booktitle = {Device Research Conference, DRC 2022, Columbus, OH, USA, June 26-29, 2022},
publisher = {IEEE},
isbn = {978-1-6654-9883-8},
}