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Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches

Fei Chong Ng, Aizat Abas, Mohd Zulkifly Abdullah. Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches. Microelectronics Reliability, 81:41-63, 2018. [doi]

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