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IC wire bond inspection using elliptical model approximation

King Ngi Ngan, Sing B. Kang. IC wire bond inspection using elliptical model approximation. In Proceedings of the 1988 IEEE International Conference on Robotics and Automation, Philadelphia, Pennsylvania, USA, April 24-29, 1988. pages 1850-1851, IEEE, 1988. [doi]

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King Ngi Ngan

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Sing B. Kang

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