Reliability studies of barrier layers for Cu/PAE low-k interconnects

H. S. Nguyen, Z. H. Gan, Zhe Chen, V. Chandrasekar, K. Prasad, S. G. Mhaisalkar, Ning Jiang. Reliability studies of barrier layers for Cu/PAE low-k interconnects. Microelectronics Reliability, 46(8):1309-1314, 2006. [doi]

Abstract

Abstract is missing.