Khai Nguyen, Ernie Opiniano, Randolph Mah. Backside Die-Edge and Underfill Fillet Cracks Induced by Additional Tensile Stress from Increasing Die-to-Package Ratio in Bare-Die FCBGA. In 2020 IEEE International Reliability Physics Symposium, IRPS 2020, Dallas, TX, USA, April 28 - May 30, 2020. pages 1-4, IEEE, 2020. [doi]
@inproceedings{NguyenOM20,
title = {Backside Die-Edge and Underfill Fillet Cracks Induced by Additional Tensile Stress from Increasing Die-to-Package Ratio in Bare-Die FCBGA},
author = {Khai Nguyen and Ernie Opiniano and Randolph Mah},
year = {2020},
doi = {10.1109/IRPS45951.2020.9129218},
url = {https://doi.org/10.1109/IRPS45951.2020.9129218},
researchr = {https://researchr.org/publication/NguyenOM20},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2020 IEEE International Reliability Physics Symposium, IRPS 2020, Dallas, TX, USA, April 28 - May 30, 2020},
publisher = {IEEE},
isbn = {978-1-7281-3199-3},
}