Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling

Tung T. Nguyen, SeungBae Park. Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling. Microelectronics Reliability, 51(8):1385-1392, 2011. [doi]

Authors

Tung T. Nguyen

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SeungBae Park

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