Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling

Tung T. Nguyen, SeungBae Park. Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling. Microelectronics Reliability, 51(8):1385-1392, 2011. [doi]

References

No references recorded for this publication.

Cited by

No citations of this publication recorded.