Temperature-Aware Floorplanning for Fixed-Outline 3D ICs - researchr publication authors

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Tianming Ni, Hao Chang, Shidong Zhu, Lin Lu, Xueyun Li, Qi Xu, Huaguo Liang, Zhengfeng Huang. Temperature-Aware Floorplanning for Fixed-Outline 3D ICs. IEEE Access, 7:139787-139794, 2019. [doi]

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