Tianming Ni, Hao Chang, Shidong Zhu, Lin Lu, Xueyun Li, Qi Xu, Huaguo Liang, Zhengfeng Huang. Temperature-Aware Floorplanning for Fixed-Outline 3D ICs. IEEE Access, 7:139787-139794, 2019. [doi]
@article{NiCZLLXLH19,
title = {Temperature-Aware Floorplanning for Fixed-Outline 3D ICs},
author = {Tianming Ni and Hao Chang and Shidong Zhu and Lin Lu and Xueyun Li and Qi Xu and Huaguo Liang and Zhengfeng Huang},
year = {2019},
doi = {10.1109/ACCESS.2019.2942839},
url = {https://doi.org/10.1109/ACCESS.2019.2942839},
researchr = {https://researchr.org/publication/NiCZLLXLH19},
cites = {0},
citedby = {0},
journal = {IEEE Access},
volume = {7},
pages = {139787-139794},
}