Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers

Mingzhi Ni, Ming Li, Dali Mao. Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers. Microelectronics Reliability, 52(1):206-211, 2012. [doi]

Abstract

Abstract is missing.