Tianming Ni, Zhao Yang, Hao Chang, Xiaoqiang Zhang, Lin Lu, Aibin Yan, Zhengfeng Huang, Xiaoqing Wen. A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using Honeycomb Topology. IEEE Trans. Emerging Topics Comput., 9(2):724-734, 2021. [doi]
@article{NiYCZLYHW21,
title = {A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using Honeycomb Topology},
author = {Tianming Ni and Zhao Yang and Hao Chang and Xiaoqiang Zhang and Lin Lu and Aibin Yan and Zhengfeng Huang and Xiaoqing Wen},
year = {2021},
doi = {10.1109/TETC.2020.2969237},
url = {https://doi.org/10.1109/TETC.2020.2969237},
researchr = {https://researchr.org/publication/NiYCZLYHW21},
cites = {0},
citedby = {0},
journal = {IEEE Trans. Emerging Topics Comput.},
volume = {9},
number = {2},
pages = {724-734},
}