Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies

M. Niedermayer, Stephan Guttowski, R. Thomasius, D. Polityko, K. Schrank, Herbert Reichl. Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies. In John A. Stankovic, Phillip B. Gibbons, Stephen B. Wicker, Joseph A. Paradiso, editors, Proceedings of the Fifth International Conference on Information Processing in Sensor Networks, IPSN 2006, Nashville, Tennessee, USA, April 19-21, 2006. pages 391-398, ACM, 2006. [doi]

@inproceedings{NiedermayerGTPSR06,
  title = {Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies},
  author = {M. Niedermayer and Stephan Guttowski and R. Thomasius and D. Polityko and K. Schrank and Herbert Reichl},
  year = {2006},
  doi = {10.1145/1127777.1127836},
  url = {http://doi.acm.org/10.1145/1127777.1127836},
  tags = {rule-based},
  researchr = {https://researchr.org/publication/NiedermayerGTPSR06},
  cites = {0},
  citedby = {0},
  pages = {391-398},
  booktitle = {Proceedings of the Fifth International Conference on Information Processing in Sensor Networks, IPSN 2006, Nashville, Tennessee, USA, April 19-21, 2006},
  editor = {John A. Stankovic and Phillip B. Gibbons and Stephen B. Wicker and Joseph A. Paradiso},
  publisher = {ACM},
  isbn = {1-59593-334-4},
}