Yuling Niu, Jing Wang, Shuai Shao 0002, Huayan Wang, Hohyung Lee, SeungBae Park. A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method. Microelectronics Reliability, 87:81-88, 2018. [doi]
@article{NiuWSWLP18,
title = {A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method},
author = {Yuling Niu and Jing Wang and Shuai Shao 0002 and Huayan Wang and Hohyung Lee and SeungBae Park},
year = {2018},
doi = {10.1016/j.microrel.2018.06.006},
url = {https://doi.org/10.1016/j.microrel.2018.06.006},
researchr = {https://researchr.org/publication/NiuWSWLP18},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {87},
pages = {81-88},
}