Challenges and solution approaches for the online simulation of semiconductor wafer fabs

Daniel Noack, Marcin Mosinski, Oliver Rose, Peter Lendermann, Boon-Ping Gan, Wolfgang Scholl. Challenges and solution approaches for the online simulation of semiconductor wafer fabs. In S. Jain, Roy R. Creasey Jr., Jan Himmelspach, K. Preston White, Michael C. Fu, editors, Winter Simulation Conference 2011, WSC'11, Phoenix, AZ, USA, December 11-14, 2011. pages 1845-1856, WSC, 2011. [doi]

Authors

Daniel Noack

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Marcin Mosinski

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Oliver Rose

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Peter Lendermann

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Boon-Ping Gan

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Wolfgang Scholl

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