Daniel Noack, Marcin Mosinski, Oliver Rose, Peter Lendermann, Boon-Ping Gan, Wolfgang Scholl. Challenges and solution approaches for the online simulation of semiconductor wafer fabs. In S. Jain, Roy R. Creasey Jr., Jan Himmelspach, K. Preston White, Michael C. Fu, editors, Winter Simulation Conference 2011, WSC'11, Phoenix, AZ, USA, December 11-14, 2011. pages 1845-1856, WSC, 2011. [doi]
@inproceedings{NoackMRLGS11,
title = {Challenges and solution approaches for the online simulation of semiconductor wafer fabs},
author = {Daniel Noack and Marcin Mosinski and Oliver Rose and Peter Lendermann and Boon-Ping Gan and Wolfgang Scholl},
year = {2011},
url = {http://dl.acm.org/citation.cfm?id=2431735},
researchr = {https://researchr.org/publication/NoackMRLGS11},
cites = {0},
citedby = {0},
pages = {1845-1856},
booktitle = {Winter Simulation Conference 2011, WSC'11, Phoenix, AZ, USA, December 11-14, 2011},
editor = {S. Jain and Roy R. Creasey Jr. and Jan Himmelspach and K. Preston White and Michael C. Fu},
publisher = {WSC},
}