Brandon Noia, Krishnendu Chakrabarty. Pre-bond testing of die logic and TSVs in high performance 3D-SICs. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]
@inproceedings{NoiaC11-0,
title = {Pre-bond testing of die logic and TSVs in high performance 3D-SICs},
author = {Brandon Noia and Krishnendu Chakrabarty},
year = {2011},
doi = {10.1109/3DIC.2012.6263042},
url = {http://dx.doi.org/10.1109/3DIC.2012.6263042},
researchr = {https://researchr.org/publication/NoiaC11-0},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012},
editor = {Mitsumasa Koyanagi and Morihiro Kada},
publisher = {IEEE},
isbn = {978-1-4673-2189-1},
}