Brandon Noia, Krishnendu Chakrabarty. Pre-bond testing of die logic and TSVs in high performance 3D-SICs. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]
Abstract is missing.