Laurenz Notter, Jacques Jacot. Assembly of Silicon Micro-parts with Steel Spindles Using Low-Temperature Soldering. In Svetan M. Ratchev, editor, Precision Assembly Technologies and Systems - 7th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2014, Chamonix, France, February 16-18, 2014, Revised Selected Papers. Volume 435 of IFIP Advances in Information and Communication Technology, pages 8-14, Springer, 2014. [doi]
Abstract is missing.