Somchai Nuanprasert, Sueki Baba, Takashi Suzuki. An efficient method of occluded solder ball segmentation for automated BGA void defect inspection using X-ray images. In IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society, Yokohama, Japan, November 9-12, 2015. pages 3308-3313, IEEE, 2015. [doi]
@inproceedings{NuanprasertBS15,
title = {An efficient method of occluded solder ball segmentation for automated BGA void defect inspection using X-ray images},
author = {Somchai Nuanprasert and Sueki Baba and Takashi Suzuki},
year = {2015},
doi = {10.1109/IECON.2015.7392610},
url = {https://doi.org/10.1109/IECON.2015.7392610},
researchr = {https://researchr.org/publication/NuanprasertBS15},
cites = {0},
citedby = {0},
pages = {3308-3313},
booktitle = {IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society, Yokohama, Japan, November 9-12, 2015},
publisher = {IEEE},
isbn = {978-1-4799-1762-4},
}