Somchai Nuanprasert, Sueki Baba, Takashi Suzuki. An efficient method of occluded solder ball segmentation for automated BGA void defect inspection using X-ray images. In IECON 2015 - 41st Annual Conference of the IEEE Industrial Electronics Society, Yokohama, Japan, November 9-12, 2015. pages 3308-3313, IEEE, 2015. [doi]
Abstract is missing.