An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method

Kenneth Chimezie Nwanoro, Hua Lu 0003, Chunyan Yin, Chris Bailey. An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87:1-14, 2018. [doi]

Authors

Kenneth Chimezie Nwanoro

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Hua Lu 0003

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Chunyan Yin

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Chris Bailey

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