Kenneth Chimezie Nwanoro, Hua Lu 0003, Chunyan Yin, Chris Bailey. An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectronics Reliability, 87:1-14, 2018. [doi]
@article{NwanoroLYB18,
title = {An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method},
author = {Kenneth Chimezie Nwanoro and Hua Lu 0003 and Chunyan Yin and Chris Bailey},
year = {2018},
doi = {10.1016/j.microrel.2018.05.013},
url = {https://doi.org/10.1016/j.microrel.2018.05.013},
researchr = {https://researchr.org/publication/NwanoroLYB18},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {87},
pages = {1-14},
}