Silicon interposer platform with low-loss through-silicon vias using air

Hanju Oh, Gary S. May, Muhannad S. Bakir. Silicon interposer platform with low-loss through-silicon vias using air. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]

Authors

Hanju Oh

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Gary S. May

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Muhannad S. Bakir

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