Reduction of Bubble-Induced Defect in Semiconductor Lithography Process

Kyoung-Whan Oh, Takashi Sasa, Seok Heo, Daejung Kim, Ouiserg Kim, Jung-Hyeon Kim. Reduction of Bubble-Induced Defect in Semiconductor Lithography Process. In Denis Cavallucci, Pavel Livotov, Stelian Brad, editors, Towards AI-Aided Invention and Innovation - 23rd International TRIZ Future Conference, TFC 2023, Offenburg, Germany, September 12-14, 2023, Proceedings. Volume 682 of IFIP Advances in Information and Communication Technology, pages 493-503, Springer, 2023. [doi]

Abstract

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