F2: 3D stacking technologies for image sensors and memories

Yusuke Oike, Makoto Ikeda, Albert Theuwissen, Johannes Solhusvik, Jonathan Chang, Tadahiro Kuroda. F2: 3D stacking technologies for image sensors and memories. In 2014 IEEE International Conference on Solid-State Circuits Conference, ISSCC 2014, Digest of Technical Papers, San Francisco, CA, USA, February 9-13, 2014. pages 512-513, IEEE, 2014. [doi]

Abstract

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