Thermal Driven Module Placement Using Sequence-pair

N. Okada, Chikaaki Kodama, T. Sato, Kunihiro Fujiyoshi. Thermal Driven Module Placement Using Sequence-pair. In IEEE Asia Pacific Conference on Circuits and Systems 2006, APCCAS 2006, Singapore, 4-7 December 2006. pages 1871-1874, IEEE, 2006. [doi]

Authors

N. Okada

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Chikaaki Kodama

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T. Sato

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Kunihiro Fujiyoshi

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