N. Okada, Chikaaki Kodama, T. Sato, Kunihiro Fujiyoshi. Thermal Driven Module Placement Using Sequence-pair. In IEEE Asia Pacific Conference on Circuits and Systems 2006, APCCAS 2006, Singapore, 4-7 December 2006. pages 1871-1874, IEEE, 2006. [doi]
@inproceedings{OkadaKSF06,
title = {Thermal Driven Module Placement Using Sequence-pair},
author = {N. Okada and Chikaaki Kodama and T. Sato and Kunihiro Fujiyoshi},
year = {2006},
doi = {10.1109/APCCAS.2006.342204},
url = {http://dx.doi.org/10.1109/APCCAS.2006.342204},
researchr = {https://researchr.org/publication/OkadaKSF06},
cites = {0},
citedby = {0},
pages = {1871-1874},
booktitle = {IEEE Asia Pacific Conference on Circuits and Systems 2006, APCCAS 2006, Singapore, 4-7 December 2006},
publisher = {IEEE},
}