Scenario for catastrophic failure in interconnect structures under chip package interaction - researchr publication authors

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Masaki Omiya, Shoji Kamiya, Nobuyuki Shishido, Kozo Koiwa, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo. Scenario for catastrophic failure in interconnect structures under chip package interaction. In IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015. pages 5, IEEE, 2015. [doi]

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