Masaki Omiya, Shoji Kamiya, Nobuyuki Shishido, Kozo Koiwa, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo. Scenario for catastrophic failure in interconnect structures under chip package interaction. In IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015. pages 5, IEEE, 2015. [doi]
@inproceedings{OmiyaKSKSNSNSN15,
title = {Scenario for catastrophic failure in interconnect structures under chip package interaction},
author = {Masaki Omiya and Shoji Kamiya and Nobuyuki Shishido and Kozo Koiwa and Hisashi Sato and Masahiro Nishida and Takashi Suzuki and Tomoji Nakamura and Toshiaki Suzuki and Takeshi Nokuo},
year = {2015},
doi = {10.1109/IRPS.2015.7112751},
url = {http://dx.doi.org/10.1109/IRPS.2015.7112751},
researchr = {https://researchr.org/publication/OmiyaKSKSNSNSN15},
cites = {0},
citedby = {0},
pages = {5},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2015, Monterey, CA, USA, April 19-23, 2015},
publisher = {IEEE},
isbn = {978-1-4673-7362-3},
}