Inter-Batch Gap Filling Using Compressive Sampling for Low-Cost IoT Vibration Sensors

Boon-Yaik Ooi, Soung-Yue Liew, Woan Lin Beh, Shervin Shirmohammadi. Inter-Batch Gap Filling Using Compressive Sampling for Low-Cost IoT Vibration Sensors. In IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2021, Glasgow, United Kingdom, May 17-20, 2021. pages 1-6, IEEE, 2021. [doi]

Authors

Boon-Yaik Ooi

This author has not been identified. Look up 'Boon-Yaik Ooi' in Google

Soung-Yue Liew

This author has not been identified. Look up 'Soung-Yue Liew' in Google

Woan Lin Beh

This author has not been identified. Look up 'Woan Lin Beh' in Google

Shervin Shirmohammadi

This author has not been identified. Look up 'Shervin Shirmohammadi' in Google