Additive interconnect fabrication by picosecond Laser Induced Forward Transfer

Gerrit Oosterhuis, Bert Huis in 't Veld, Gerald Ebberink, Daniël Arnaldo del Cerro, Edwin van den Eijnden, Peter Chall, Ben van der Zon. Additive interconnect fabrication by picosecond Laser Induced Forward Transfer. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-5, IEEE, 2010. [doi]

@inproceedings{OosterhuisVECECZ10,
  title = {Additive interconnect fabrication by picosecond Laser Induced Forward Transfer},
  author = {Gerrit Oosterhuis and Bert Huis in 't Veld and Gerald Ebberink and Daniël Arnaldo del Cerro and Edwin van den Eijnden and Peter Chall and Ben van der Zon},
  year = {2010},
  doi = {10.1109/3DIC.2010.5751481},
  url = {http://dx.doi.org/10.1109/3DIC.2010.5751481},
  researchr = {https://researchr.org/publication/OosterhuisVECECZ10},
  cites = {0},
  citedby = {0},
  pages = {1-5},
  booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010},
  publisher = {IEEE},
}