Additive interconnect fabrication by picosecond Laser Induced Forward Transfer

Gerrit Oosterhuis, Bert Huis in 't Veld, Gerald Ebberink, Daniƫl Arnaldo del Cerro, Edwin van den Eijnden, Peter Chall, Ben van der Zon. Additive interconnect fabrication by picosecond Laser Induced Forward Transfer. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-5, IEEE, 2010. [doi]

Abstract

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