Experimental characterization and model validation of thermal hot spots in 3D stacked ICs - researchr publication authors

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Oprins, H., Cherman, V., Adi Srinivasan, Cupak, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Cheng, E.. Experimental characterization and model validation of thermal hot spots in 3D stacked ICs. Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, :1-5, 2010.

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