Thermal experimental and modeling analysis of high power 3D packages - researchr publication authors

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Herman Oprins, Vladimir Cherman, Geert Van der Plas, F. L. T. Maggioni, Joeri De Vos, Eric Beyne. Thermal experimental and modeling analysis of high power 3D packages. In 2015 International Conference on IC Design & Technology, ICICDT 2015, Leuven, Belgium, June 1-3, 2015. pages 1-4, IEEE, 2015. [doi]

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