Juan S. Ordonez, Christian Böhler, Martin Schuettler, Thomas Stieglitz. A blister-test apparatus for studies on the adhesion of materials used for neural electrodes. In 33rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2011, Boston, MA, USA, August 30 - Sept. 3, 2011. pages 2953-2956, IEEE, 2011. [doi]
Abstract is missing.