Electromigration failure in a copper dual-damascene structure with a through silicon via

R. L. de Orio, Hajdin Ceric, Siegfried Selberherr. Electromigration failure in a copper dual-damascene structure with a through silicon via. Microelectronics Reliability, 52(9-10):1981-1986, 2012. [doi]

Abstract

Abstract is missing.