Optimal die placement for interposer-based 3D ICs - researchr publication authors

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Sergii Osmolovskyi, Johann Knechtel, Igor L. Markov, Jens Lienig. Optimal die placement for interposer-based 3D ICs. In 23rd Asia and South Pacific Design Automation Conference, ASP-DAC 2018, Jeju, Korea (South), January 22-25, 2018. pages 513-520, IEEE, 2018. [doi]

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