Timm Ostermann. Soft failures in integrated circuits as a matter of ESD events. In 2018 International Conference on IC Design & Technology, ICICDT 2018, Otranto, Italy, June 4-6, 2018. pages 169-172, IEEE, 2018. [doi]
@inproceedings{Ostermann18-1,
title = {Soft failures in integrated circuits as a matter of ESD events},
author = {Timm Ostermann},
year = {2018},
doi = {10.1109/ICICDT.2018.8399783},
url = {https://doi.org/10.1109/ICICDT.2018.8399783},
researchr = {https://researchr.org/publication/Ostermann18-1},
cites = {0},
citedby = {0},
pages = {169-172},
booktitle = {2018 International Conference on IC Design & Technology, ICICDT 2018, Otranto, Italy, June 4-6, 2018},
publisher = {IEEE},
isbn = {978-1-5386-2550-7},
}