Yaron Ostrovsky-Berman, Leo Joskowicz. Tolerance envelopes of planar mechanical parts. In Gershon Elber, Nicholas M. Patrikalakis, Pere Brunet, editors, Proceedings of the Ninth ACM Symposium on Solid Modeling and Applications, Genova, Italy, June 09-11, 2004. pages 135-143, ACM, 2004. [doi]
Abstract is missing.