Oskars Ozolins, Armands Ostrovskis, Toms Salgals, Benjamin Krüger 0001, Fabio Pittalà, Mahdieh Joharifar, Richard Schatz, Michael Koenigsmann, Yuchuan Fan, Urban Westergren, Haïk Mardoyan, Lu Zhang 0051, Sandis Spolitis, Xianbin Yu, Markus Gruen, Vjaceslavs Bobrovs, Hadrien Louchet, Xiaodan Pang. High-Baudrate SiP and InP Modulators for Data Center Interconnects. In International Conference on Software, Telecommunications and Computer Networks, SoftCOM 2023, Split, Croatia, September 21-23, 2023. pages 1-3, IEEE, 2023. [doi]
Abstract is missing.