Maximal Resilience for Reliability and Yield Enhancement in Interconnect Structure

Chih-Yun Pai, Katherine Shu-Min Li. Maximal Resilience for Reliability and Yield Enhancement in Interconnect Structure. In Proceedings of the 19th IEEE Asian Test Symposium, ATS 2010, 1-4 December 2010, Shanghai, China. pages 261-266, IEEE Computer Society, 2010. [doi]

@inproceedings{PaiL10,
  title = {Maximal Resilience for Reliability and Yield Enhancement in Interconnect Structure},
  author = {Chih-Yun Pai and Katherine Shu-Min Li},
  year = {2010},
  doi = {10.1109/ATS.2010.53},
  url = {http://dx.doi.org/10.1109/ATS.2010.53},
  tags = {reliability},
  researchr = {https://researchr.org/publication/PaiL10},
  cites = {0},
  citedby = {0},
  pages = {261-266},
  booktitle = {Proceedings of the 19th IEEE Asian Test Symposium, ATS 2010, 1-4 December 2010, Shanghai, China},
  publisher = {IEEE Computer Society},
  isbn = {978-0-7695-4248-5},
}