SDF-Pack: Towards Compact Bin Packing with Signed-Distance-Field Minimization

Jia-Hui Pan, Ka-Hei Hui, Xiaojie Gao, Shize Zhu, Yun-Hui Liu, Pheng-Ann Heng, Chi-Wing Fu. SDF-Pack: Towards Compact Bin Packing with Signed-Distance-Field Minimization. In IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2023, Detroit, MI, USA, October 1-5, 2023. pages 10612-10619, IEEE, 2023. [doi]

@inproceedings{PanHGZLHF23,
  title = {SDF-Pack: Towards Compact Bin Packing with Signed-Distance-Field Minimization},
  author = {Jia-Hui Pan and Ka-Hei Hui and Xiaojie Gao and Shize Zhu and Yun-Hui Liu and Pheng-Ann Heng and Chi-Wing Fu},
  year = {2023},
  doi = {10.1109/IROS55552.2023.10341940},
  url = {https://doi.org/10.1109/IROS55552.2023.10341940},
  researchr = {https://researchr.org/publication/PanHGZLHF23},
  cites = {0},
  citedby = {0},
  pages = {10612-10619},
  booktitle = {IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2023, Detroit, MI, USA, October 1-5, 2023},
  publisher = {IEEE},
  isbn = {978-1-6654-9190-7},
}