Design for manufacturability and reliability for TSV-based 3D ICs - researchr publication authors

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David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang. Design for manufacturability and reliability for TSV-based 3D ICs. In Proceedings of the 17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012, Sydney, Australia, January 30 - February 2, 2012. pages 750-755, IEEE, 2012. [doi]

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