David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang. Design for manufacturability and reliability for TSV-based 3D ICs. In Proceedings of the 17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012, Sydney, Australia, January 30 - February 2, 2012. pages 750-755, IEEE, 2012. [doi]
@inproceedings{PanLAJMPPY12,
title = {Design for manufacturability and reliability for TSV-based 3D ICs},
author = {David Z. Pan and Sung Kyu Lim and Krit Athikulwongse and Moongon Jung and Joydeep Mitra and Jiwoo Pak and Mohit Pathak and Jae-Seok Yang},
year = {2012},
doi = {10.1109/ASPDAC.2012.6165055},
url = {http://dx.doi.org/10.1109/ASPDAC.2012.6165055},
researchr = {https://researchr.org/publication/PanLAJMPPY12},
cites = {0},
citedby = {0},
pages = {750-755},
booktitle = {Proceedings of the 17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012, Sydney, Australia, January 30 - February 2, 2012},
publisher = {IEEE},
isbn = {978-1-4673-0770-3},
}