Vineet Pancholi. Special Session: Test Impact of Multi-Die Packages. In 40th IEEE VLSI Test Symposium, VTS 2022, San Diego, CA, USA, April 25-27, 2022. pages 1-2, IEEE, 2022. [doi]
@inproceedings{Pancholi22,
title = {Special Session: Test Impact of Multi-Die Packages},
author = {Vineet Pancholi},
year = {2022},
doi = {10.1109/VTS52500.2021.9794143},
url = {https://doi.org/10.1109/VTS52500.2021.9794143},
researchr = {https://researchr.org/publication/Pancholi22},
cites = {0},
citedby = {0},
pages = {1-2},
booktitle = {40th IEEE VLSI Test Symposium, VTS 2022, San Diego, CA, USA, April 25-27, 2022},
publisher = {IEEE},
isbn = {978-1-6654-1060-1},
}