Vinod Pangracious, Ranjitha Dash, Ashok Kumar Turuk. 3D-cool: Design and development of adaptive thermal-aware three-dimensional NoC-based multiprocessor chip. In 2018 IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2018, Yokohama, Japan, April 18-20, 2018. pages 1-3, IEEE, 2018. [doi]
Abstract is missing.